Materials, integration and packaging issues for high-frequency devices

Author(s)

• Materials Research Society

Bibliographic Information

Materials, integration and packaging issues for high-frequency devices

（Materials Research Society symposium proceedings, v. 783, 833）

Materials Research Society, c2004-

• [1]
• 2

Note

Includes bibliographical references and indexes

1st symposium was held in December 1-3, 2003, Boston, Massachusetts, U.S.A.

2nd symposium was held in November 29-December 1, 2004, Boston, Massachusetts, U.S.A.

Details

• NCID: BA67311055
• ISBN:
  • 1558997210
  • 1558997814
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Warrendale, Pa.
• Pages/Volumes: v.
• Size: 24 cm
• Parent Bibliography ID:
  • BA00013775