Materials, integration and packaging issues for high-frequency devices
Author(s)
Bibliographic Information
Materials, integration and packaging issues for high-frequency devices
（Materials Research Society symposium proceedings, v. 783,
Materials Research Society, c2004-
- [1]
- 2
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Note
Includes bibliographical references and indexes
1st symposium was held in December 1-3, 2003, Boston, Massachusetts, U.S.A.
2nd symposium was held in November 29-December 1, 2004, Boston, Massachusetts, U.S.A.
Description and Table of Contents
Description
This book, first published in 2004, focuses on the materials technologies that are key to the advancement of high-frequency devices. The competition for better-performing mobile phones is the main driving factor in this field. In mobile phones, passive components constitute 70-90% of the number of components, volume, and costs. The spirit of the volume is to bring together scientists in the processing, characterization, packaging, device design and applications of passive devices, to gain insight into the various paths along which technology of passive components is progressing. Topics include: improvements in low-temperature co-fired ceramics; microstructure - property relationships in perovskites for new materials compositions, with lower firing temperatures, for microwave dielectrics with high-quality factors; tunable ferroelectrics allowing low-cost solutions for frequency tuning and phase shifters; new integration platforms and packaging concepts; embedded capacitors; integration of RF switches based on MEMS technology; bulk acoustic wave resonators and above-chip integration.
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