Force sensors for microelectronic packaging applications

Author(s)

Bibliographic Information

Force sensors for microelectronic packaging applications

J. Schwizer, M. Mayer, O. Brand

(Microtechnology and MEMS)

Springer-Verlag, c2005

Available at  / 3 libraries

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Note

with 149 figures

Includes bibliographical references and index

Related Books: 1-1 of 1

Details

  • NCID
    BA70688743
  • ISBN
    • 3540221875
  • LCCN
    2004110615
  • Country Code
    gw
  • Title Language Code
    eng
  • Text Language Code
    eng
  • Place of Publication
    Berlin
  • Pages/Volumes
    viii, 178 p.
  • Size
    24 cm
  • Parent Bibliography ID
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