Ultra clean processing of silicon surfaces 2000 : proceedings of the Fifth International Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS 2000), held in Ostend, Belgium, September 18-20, 2000

著者

• International Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS)
• Heyns, Marc
• Mertens, Paul
• Meuris, Marc

書誌事項

Ultra clean processing of silicon surfaces 2000 : proceedings of the Fifth International Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS 2000), held in Ostend, Belgium, September 18-20, 2000

editors, Marc Heyns, Paul Mertens and Marc Meuris

（Diffusion and defect data : solid state data, pt. B . Solid state phenomena ; v. 76-77）

Scitec Publications, c2001

注記

Includes bibliographical references and indexes

内容説明・目次

内容説明

Volume is indexed by Thomson Reuters CPCI-S (WoS). The proceedings of the Fifth International Symposium on Ultra Clean Processing of Silicon Surfaces cover all aspects of ultra-clean Si-technology: cleaning, contamination control, Si-surface chemistry and topography, and its relationship to device performance and process yield. New areas of concern include: cleaning at the interconnect level, resist strip and polymer removal (dry and wet), cleaning and contamination aspects of metallization, wafer backside cleaning and cleaning after Chemical-Mechanical-Polishing (CMP).

目次

Defects and Contamination in Microelectronic Device Production: State-of-the-Art and Prospects The Effect of Ion Implantation on the Metal Contamination of Silicon Surfaces in Aqueous Solution Barium, Strontium and Bismuth Contamination in CMOS Processes An Exploration on the Bridge Formation Mechanism of Cylindrical Storage Poly-Silicon by Water Marks in High Performance 4Gigabit DRAM Capacitor Chemical Processing and Materials Compatibility of High-K Dielectric Materials for Advanced Gate Stacks Wettability Modification of Polysilicon for Stiction Reduction in Silicon Based Micro-electromechanical Structures Dual Gate Oxide for 0.18 m Technologies and Below: Optimization of the Wet Processing Sequence New Aqueous Clean for Aluminum Interconnects: Part I. Fundamentals Metal Wet Cleaning with No Corrosion: A Novel Approach Non-Contact Post Cu CMP Cleaning Using Megasonic Energy Improved Phosphoric Acid Mixtures for Nitride Strip Silicon Wafer Cleaning Processes Monitoring by the Surface Charge Profiler Method New Aqueous Clean for Aluminum Interconnects: Part II. Applications Synchronous Schlieren Image Analysis of Megasonic Single Wafer Cleaning Dry Cleaning of Organic Contamination on Silicon Wafers Using Rapid Optical Surface Treatment Materials Compatibility and Organic Build-Up during Ozone-Based Cleaning of Semiconductor Devices Surface Characterization after Different Wet Chemical Cleans A Hydrogenated Water Application to Semiconductor Manufacturing Investigation of Trace Metals Analyses of Dry Residue on Silicon Wafer Surfaces by TXRF and ICP-MS Electrochemical Study for the Characterization of Wet Silicon Oxide Surfaces Pre-Diffusion Cleaning Using Ozone and HF Novel Back Side Processes for Copper and Pre-Lithography Cleans Optimisations of SC-1 Conditions for Sub 0.18 m Technologies in an Industrial Environment Reduced Water Consumption for Post Clean Treatment and Metal Ion Contamination on VLSI Structures Post SiN Etching Cleaning During Copper and Low K Integration Wet Preparation of Defect-Free Hydrogen-Terminated Silicon Wafer Surface and Its Characterization in Atomic-Scale Detection and Identification of Organic Contamination on Silicon Substrates Preparation and Characterization of Time Dependent Haze on Silicon Surfaces Single Chemistry Cleaning Solution for Advanced Wafer Cleaning Behaviors of Metallic Contaminants in Si Wafer Processing Iron Bulk Concentration Effect on the Yield & Reliability of Thin Oxides Gap States at the Interface of Ultra-Thin Oxide and Organic Films on Si(100) Modification of Low-K SiCOH Film Porosity by a HF Solution Layer-By-Layer Oxidation of Silicon The Evolution of Chemical Oxides Into Ultrathin Oxides: A Spectroscopic Characterization Influence of Boron and Fluorine Incorporation on the Network Structure of Ultrathin SiO2 The Origins of Fluorine in Dry Ultrathin Silicon Oxides Structural and Electrical Characterization of Ultra-Thin SiO2 Films Prepared by Catalytic Oxidation Method Characterization of DI Water/O3 Oxidation of Si (100) and Si (111) Surfaces by OCP Measurements Effect of Chemical Oxides Formed During Pre-Gate Oxide Cleaning on the Properties of Sub 20A Thick Ultra-Thin Stack Gate Dielectrics Controlling Silicon Surface Roughness During Photochemical Cleaning Influence of Cleaning on the Quality of the Bonding Interface in Direct Bonded Silicon Wafers Characterization and Production Metrology of Thin Transistor Gate Dielectric Films Electronic Properties of Wet-Chemically Prepared Oxide Layers A Probe of Chemical Oxide Growth Conditions Fundamentals of Wafer Rinse Processes and the Interactions with Water Conservation and Recycling in Semiconductor Manufacturing Plants A Novel Rinsing Tank Concept to Save DI Water Using an Internal Recirculation Flow: 'Circle Stream Rinser' Rinsing and Drying Effects on Heterogeneous Substrates Low Consumption Front End of the Line Cleaning: LC-FEOL New Single Wafer Double Sided Spin Cleaning Method Determination of Photoresist Degradation Products in O3/DI Processing The Ozone Solubility and its Decay in Aqueous Solutions: Crucial Issues in Ozonated Chemistries for Semiconductor Cleaning Control of Ozonated Water Cleaning Process for Photoresist Removal New Method to Generate the High Concentration Ozonated Water by Using the Ultrapure Water of the Semiconductor Factory A Controlled Deposition of Organic Contamination and the Removal with Ozone Based Cleanings From Piranha to Barracuda: Mechanism of Ozone and Water Vapor Photoresist Strip in a Wet Bench Photo Resist Stripping Using an Alkaline Accelerator Containing Wet-Vapor Megasonic Silicon Wafer Cleaning and Its Influence on LSI Devices Application of Megasonic Single Wafer Cleaning Technology to LSI Mass Production Line Particle Removal Mechanism of Hydrogenated Ultrapure Water with Megasonic Irradiation Megasonic, Non-Contact Cleaning Followed by 'Rotagoni' Drying of CMP Wafers Particle Deposition Studies in Acidic Solutions Particle Removal Efficiency Evaluation at 40 nm Using Haze Particle Standard Use of Surfactants for Improved Particle Performance of dHF-Based Cleaning Recipes The Role of Oxidant in HF-Based Solution for Noble Metal Removal from Substrate Effect of Surface Charge and Fluid Properties on Particle Removal Characteristics of a Surface-Optimized REB Filter Pattern Dependent Corrosion Effects in HF Based Post Cu CMP Cleanings Effect of Copper on the Breakthrough Voltage of Poly-Si - Poly-Si Capacitors New Insights into Particle Adhesion SC-1 Clean Improvements for Post STI CMP Contamination and Cleaning of Oxide Areas Exposed During Copper CMP in Hydroxylamine Based Slurries Post Copper CMP: a Two Steps Cleaning Recipe Silicon Surface Cleaning after Spacer Dry Etching The Effect of DI Water and Intermediate Rinse Solutions on Post Metal Etch Residue Removal Using Semi-Aqueous Cleaning Chemistries Wet Cleaning of Trenches and Vias after Oxide/Nitride Dry Etch with Cu Exposed

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詳細情報

• NII書誌ID(NCID): BA7192768X
• ISBN:
  • 3908450578
• 出版国コード: sz
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Uetikon-Zuerich
• ページ数/冊数: xiii, 321 p.
• 大きさ: 25 cm
• 親書誌ID:
  • BA07841800