Materials, integration and tecnology for monolithic instruments : symposium held March 29-30, 2005, San Francisco, California, U.S.A.

Author(s)

    • Theil, Jeremy A.

Bibliographic Information

Materials, integration and tecnology for monolithic instruments : symposium held March 29-30, 2005, San Francisco, California, U.S.A.

editors, Jeremy A. Theil ... [et al.]

(Materials Research Society symposium proceedings, v. 869)

Materials Research Society, c2005

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Note

Includes bibliographical references and indexes

Description and Table of Contents

Description

The field of integrated circuits is now on the cusp of a new level of integration that can enable an entirely new class of products - monolithic instruments. These are miniaturized systems which interact with their physical environment in ways traditional integrated circuits cannot, in particular, by combining conventional integrated circuits with novel solid-state components. These systems are enabled by utilizing the extremely precise manufacturing platform that is the integrated circuit wafer fabrication facility. The monolithic instrument concept is quite powerful in that it enables vast cost and size reductions. The papers presented in this book are a subset of what is possible in this field. Section I examines advanced image sensor concepts based on forming the photodetector above the standard CMOS interconnect. Section II focuses on optoelectronic element integration, including critical components for constructing miniaturized spectrometers. Section III features chemical and biological sensing systems. Section IV highlights functional oxides and other materials for monolithic integration.

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Details

  • NCID
    BA7316920X
  • ISBN
    • 1558998233
  • Country Code
    us
  • Title Language Code
    eng
  • Text Language Code
    eng
  • Place of Publication
    Warrendale, Pa.
  • Pages/Volumes
    ix, 171 p.
  • Size
    24 cm
  • Parent Bibliography ID
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