Materials, integration and packaging issues for high-frequency devices II : symposium held November 29-December 1, 2004, Boston, Massachusetts, U.S.A.

著者

• Materials Research Society
• Cho, Yong S.

書誌事項

Materials, integration and packaging issues for high-frequency devices II : symposium held November 29-December 1, 2004, Boston, Massachusetts, U.S.A.

editors, Yong S. Cho ... [et al.]

（Materials Research Society symposium proceedings, v. 833）

Materials Research Society, c2005

注記

Includes bibliographical references and indexes

詳細情報

• NII書誌ID(NCID): BA73171529
• ISBN:
  • 1558997814
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Warrendale, Pa.
• ページ数/冊数: xi, 270 p.
• 大きさ: 24 cm
• 親書誌ID:
  • BA00013775