Materials, integration and packaging issues for high-frequency devices II : symposium held November 29-December 1, 2004, Boston, Massachusetts, U.S.A.

Author(s)

• Materials Research Society
• Cho, Yong S.

Bibliographic Information

Materials, integration and packaging issues for high-frequency devices II : symposium held November 29-December 1, 2004, Boston, Massachusetts, U.S.A.

editors, Yong S. Cho ... [et al.]

（Materials Research Society symposium proceedings, v. 833）

Materials Research Society, c2005

Note

Includes bibliographical references and indexes

Details

• NCID: BA73171529
• ISBN:
  • 1558997814
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Warrendale, Pa.
• Pages/Volumes: xi, 270 p.
• Size: 24 cm
• Parent Bibliography ID:
  • BA00013775