{"@context":{"owl":"http://www.w3.org/2002/07/owl#","bibo":"http://purl.org/ontology/bibo/","foaf":"http://xmlns.com/foaf/0.1/","rdfs":"http://www.w3.org/2000/01/rdf-schema#","prism":"http://prismstandard.org/namespaces/basic/2.0/","cinii":"http://ci.nii.ac.jp/ns/1.0/","dc":"http://purl.org/dc/elements/1.1/","dcterms":"http://purl.org/dc/terms/"},"@id":"https://ci.nii.ac.jp/ncid/BA75359975.json","@graph":[{"@id":"https://ci.nii.ac.jp/ncid/BA75359975#entity","@type":"bibo:Book","foaf:isPrimaryTopicOf":{"@id":"https://ci.nii.ac.jp/ncid/BA75359975.json"},"dc:title":[{"@value":"Electronic and photonic packaging, electrical systems design and photonics, and nanotechnology : presented at the 2004 ASME International Mechanical Engineering Congress and Exposition : November 13-19, 2004, Anaheim, California USA"}],"dc:creator":"sponsored by the Electronic and Photonic Packaging Division, ASME","dc:publisher":[{"@value":"American Society of Mechanical Engineers"}],"dcterms:extent":"ix, 586 p.","cinii:size":"28 cm","dc:language":"eng","dc:date":"2004","cinii:ncid":"BA75359975","cinii:ownerCount":"1","foaf:maker":[{"@id":"https://ci.nii.ac.jp/author/DA15291031#entity","@type":"foaf:Person","foaf:name":[{"@value":"American Society of Mechanical Engineers. Electronic and Photonic Packaging Division"}]},{"@id":"https://ci.nii.ac.jp/author/DA09785194#entity","@type":"foaf:Person","foaf:name":[{"@value":"International Mechanical Engineering Congress and Exposition"}]}],"bibo:owner":[{"@id":"https://ci.nii.ac.jp/library/FA000106","@type":"foaf:Organization","foaf:name":"東京科学大学 大岡山図書館","rdfs:seeAlso":{"@id":"https://topics.libra.titech.ac.jp/recordID/catalog.bib/BA75359975"}}],"prism:publicationDate":["c2004"],"cinii:note":["Includes bibliographical references and index"],"dc:subject":["LCC:TK7870.15"],"foaf:topic":[{"@id":"https://ci.nii.ac.jp/books/search?q=Electronic+packaging+--+Congresses","dc:title":"Electronic packaging -- Congresses"},{"@id":"https://ci.nii.ac.jp/books/search?q=Photonics+--+Congresses","dc:title":"Photonics -- Congresses"},{"@id":"https://ci.nii.ac.jp/books/search?q=Nanotechnology+--+Congresses","dc:title":"Nanotechnology -- Congresses"},{"@id":"https://ci.nii.ac.jp/books/search?q=Microelectronic+packaging+--+Congresses","dc:title":"Microelectronic packaging -- Congresses"},{"@id":"https://ci.nii.ac.jp/books/search?q=Surface+mount+technology+--+Congresses","dc:title":"Surface mount technology -- Congresses"},{"@id":"https://ci.nii.ac.jp/books/search?q=Microelectromechanical+systems+--+Congresses","dc:title":"Microelectromechanical systems -- Congresses"},{"@id":"https://ci.nii.ac.jp/books/search?q=Integrated+circuits+--+Wafer-scale+integration+--+Congresses","dc:title":"Integrated circuits -- Wafer-scale integration -- Congresses"}],"dcterms:isPartOf":[{"@id":"https://ci.nii.ac.jp/ncid/BA6132699X#entity","dc:title":"EPP, v. 4","@type":"bibo:Book"}],"dcterms:hasPart":[{"@id":"urn:isbn:0791847071"}]}]}