Scientific wet process technology for innovative LSI/FPD manufacturing
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Bibliographic Information
Scientific wet process technology for innovative LSI/FPD manufacturing
CRC, Taylor & Francis, 2006
- : hardcover
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"A CRC Press book"--Back cover
Includes bibliographical references and index
Description and Table of Contents
Description
As science pushes closer toward the atomic size scale, new challenges arise to slow the pace of the miniaturization that has transformed our society and fueled the information age. New technologies are necessary to surpass these obstacles and realize the tremendous growth predicted by Moore's law. Assembled from the works of pioneering researchers, Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing presents new developments and technologies for producing the next generation of electronic circuits and displays.
This book introduces radical-reaction-based semiconductor manufacturing technologies that overcome the limitations of the existing molecule-reaction-based technologies. It systematically details the procedures and underlying concepts involved in wet process technologies and applications. Following an introduction to semiconductor surface chemical electronics, expert contributors discuss the principles and technology of high-performance wet cleaning; etching technologies and processes; antistatic technology; wet vapor resist stripping technology; and process and safety technologies including waste reclamation, chemical composition control, and ultrapure water and liquid chemical supply systems and materials for fluctuation-free facilities.
Currently, large production runs are needed to balance the costs of acquiring and tuning equipment for specialized operating conditions. Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing explains the technologies and processes used to meet the demand for variety and low volumes that exists in today's digital electronics marketplace.
Table of Contents
Surface Chemical Electronics at the Semiconductor Surface. Principles of Semiconductor Device Wet Cleaning. High-Performance Wet-Cleaning Technology. Etching of Various SiO2. Silicon Etching. Chemical Composition Control Technology. Wet Vapor Resist Stripping Technology. Antistatic Technology. Chemical Waste Reclamation Technology. Ultrapure Water and Gas-Dissolved Water Supply System for Fluctuation-Free Facility.
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