Tutorial guide : ISCAS 2003, IEEE International Symposium on Circuits and Systems, 25-28 May 2003, Bangkok, Thailand
著者
書誌事項
Tutorial guide : ISCAS 2003, IEEE International Symposium on Circuits and Systems, 25-28 May 2003, Bangkok, Thailand
[IEEE Circuits and Systems Society], c2003
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- v. 2
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注記
Includes bibliographical references
"IEEE Catalog Number: 03TH8704"--T.p. verso
内容説明・目次
内容説明
This text covers topics including: leading edge packaging technology; Pb-free interconnections; quality and reliability issues of portable products; high-density substrates and embedded components; and leaded and lead-free solder characterization and modelling.
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