Chip scale package (CSP) : design, materials, processes, reliability, and applications

Author(s)

Bibliographic Information

Chip scale package (CSP) : design, materials, processes, reliability, and applications

John H. Lau, Shi-Wei Ricky Lee

(Electronic packaging and interconnection series)

McGraw-Hill, c1999

Other Title

Chip scale package

Available at  / 1 libraries

Search this Book/Journal

Related Books: 1-1 of 1

Details

Page Top