Process technology for silicon carbide devices

Author(s)

    • Zetterling, Carl-Mikael
    • Institution of Electrical Engineers

Bibliographic Information

Process technology for silicon carbide devices

edited by Carl-Mikael Zetterling

(EMIS processing series / Series advisor B.L. Weiss, 2)

INSPEC, c2002

Available at  / 3 libraries

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Note

Includes bibliographical references and index

Description and Table of Contents

Description

Silicon carbide (SiC) is a wide bandgap semiconductor whose properties make it suitable for devices and integrated circuits operating at high voltage, high frequency and high temperature. This second book in the Processing series explains why SiC is so useful in electronics and gives clear guidance on the various processing steps. Growth, doping, etching, contact formation and dielectrics are all described in detail. The final chapter explains how to integrate the processing steps, and shows typical device cross-sections for over 20 different devices. Engineers who are developing systems for the fabrication of SiC devices are in need of guidance from experts in academia and the industry who have been pioneering the field: the book is designed as an advanced tutorial and reference for this purpose. A glossary of terms used in SiC technology is included.

Table of Contents

Chapter 1: Advantages of SiC Chapter 2: Bulk and epitaxial growth of SiC Chapter 3: Ion implantation and diffusion in SiC Chapter 4: Wet and dry etching of SiC3 Ion implantation and diffusion in SiC Chapter 5: Thermally grown and deposited dielectrics on SiC Chapter 6: Schottky and ohmic contacts to SiC Chapter 7: Devices in SiC

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