Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.

著者

• Materials, Technology and Reliability of Low-k Dielectrics and Cooper Interconnects
• Tsui, Ting Y.

書誌事項

Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.

editors, Ting Y. Tsui ... [et al.]

（Materials Research Society symposium proceedings, v. 914）

Materials Research Society, c2006

注記

"... Symposium F, "Materials, Technology and Reliability of Low-k Dielectrics and Cooper Interconnects," held April 18-21 at the 2006 MRS Spring Meeting in San Francisco, California ..."--Pref

Includes bibliographical references and indexes

• NII書誌ID(NCID): BA78618898
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Warrendale, Pa.
• ページ数/冊数: xvii, 462 p.
• 大きさ: 24 cm
• 件名:
  • LCSH : Semiconductors -- Materials -- Congresses
  • LCSH : Semiconductors -- Junctions -- Congresses
  • LCSH : Dielectric films -- Congresses
  • LCSH : Integrated circuits -- Materials -- Congresses
  • LCSH : Integrated circuits -- Reliability -- Congresses
• 親書誌ID:
  • BA00013775