Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.

Author(s)

• Materials, Technology and Reliability of Low-k Dielectrics and Cooper Interconnects
• Tsui, Ting Y.

Bibliographic Information

Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.

editors, Ting Y. Tsui ... [et al.]

（Materials Research Society symposium proceedings, v. 914）

Materials Research Society, c2006

Note

"... Symposium F, "Materials, Technology and Reliability of Low-k Dielectrics and Cooper Interconnects," held April 18-21 at the 2006 MRS Spring Meeting in San Francisco, California ..."--Pref

Includes bibliographical references and indexes

Details

• NCID: BA78618898
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Warrendale, Pa.
• Pages/Volumes: xvii, 462 p.
• Size: 24 cm
• Subject Headings:
  • LCSH : Semiconductors -- Materials -- Congresses
  • LCSH : Semiconductors -- Junctions -- Congresses
  • LCSH : Dielectric films -- Congresses
  • LCSH : Integrated circuits -- Materials -- Congresses
  • LCSH : Integrated circuits -- Reliability -- Congresses
• Parent Bibliography ID:
  • BA00013775