Area array packaging handbook
Author(s)
Bibliographic Information
Area array packaging handbook
（McGraw-Hill packaging and electronics books）（McGraw-Hill handbooks）
McGraw-Hill, c2002
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Note
Includes bibliographical references and index
Cover title:Area array packaging handbook : manufacturing and assembly
Description and Table of Contents
Description
This book covers area array packaging at the cutting-edge. This is the first book to bring BGA, CSP, and Flip Chip together - teaching design, application, and manufacturing how-tos. As pagers, cell phones, and other portable electronics shrink while demand for features and functions grows, the need for better, faster, smaller, cooler high-density interconnects (HDI) becomes more critical. "The Area Array Packaging Handbook" brings you the details you need on this rapidly expanding field in microelectronics packaging.Filled with hands-on, leading edge information engineers need for day-to-day decision making, "Area Array Packaging Handbook" is an unbeatable resource for success in today's fast-paced world of HDI.
Look for these highlights inside: the hottest technologies in electronics packaging - BGA, CSP, and Flip Chip - all in one reference; details on MEMs technology; pros and cons of each technology in various applications; solutions for difficult packaging ramifications of HDI design concepts; detailed coverage of critical reliability and testing issues; help with design, materials, and manufacturing processes; problem-solving approaches to conception, construction, assembly, and applications; world-class expert contributors; and, 400 illustrations. It covers advances, applications, concepts, design, economics, opimization, equipment, future, technology, materials, processes, and productivity.
Table of Contents
Forword Section 1: Packaging Concepts and Design Chapter 1: Introduction to Electronic Packaging Chapter 2: Electronics Industry Overview Chapter 3: Trends/Drivers in the Electronics Manufacturing Industry Chapter 4: Area Array Packaging Chapter 5: Stacked/3D Packages Chapter 6: Compliant IC Packaging Chapter 7: Flip Chip Technology Chapter 8: Options in High-Density Part Cleaning Chapter 9: MEMS Packaging and Assembly Challenges Chapter 10: Ceramic Ball and Column Grid Array Overview Section 2: Materials Chapter 11: Polyer Packaging Materials: Adhesives, Encapsulants, and Underfills Chapter 12: Hermetic Packaging Systems: Adhesive and Getter Chapter 13: Area Array Solder Spheres, Pastes, and Fluxes Chapter 14: Modern Solder and Solder Paste Chapter 15: Lead-Free Systems and Process Implications Chapter 16: Electrically Conductive Adhesives for Surface-Mount and Flip Chip Processes: An Alternative to Solder? Section 3: Equipment and Processes Chapter 17: Next-Generation Flip Chip Materials and Processes Chapter 18: Flip Chip Assembly and Underfilling Chapter 19: BGA and CSP Rework: What is Involved? Chapter 20: BGA Assembly Reliability Chapter 21: Die Attach and Rework Chapter 22: Liquid Encapsulation Equipment and Processes Chapter 23: Molding for Area Array Packages Chapter 24: Screen Printing and Stenciling Chapter 25: Criteria for Placement and Processing of Advanced Packages Chapter 26: Ovens in Electronics Chapter 27: Process Development, Control, and Organization Section 4: Economics and Productivity Chapter 28: Metrics: The Key to Productivity Chapter 29: Cost Estimating for Electronic Assembly Section 5: Future Chapter 30: The Future of Electronic Packaging Chapter 31: The Future of SMT Process Equipment Index
by "Nielsen BookData"
