Optical inspection of microsystems
著者
書誌事項
Optical inspection of microsystems
（Optical science and engineering, 109）
CRC/Taylor & Francis, c2007
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注記
Includes bibliographical references and index
内容説明・目次
内容説明
Where conventional testing and inspection techniques fail at the micro-scale, optical techniques provide a fast, robust, and relatively inexpensive alternative for investigating the properties and quality of microsystems. Speed, reliability, and cost are critical factors in the continued scale-up of microsystems technology across many industries, and optical techniques are in a unique position to satisfy modern commercial and industrial demands. Optical Inspection of Microsystems is the first comprehensive, up-to-date survey of the most important and widely used full-field optical metrology and inspection technologies. Under the guidance of accomplished researcher Wolfgang Osten, expert contributors from industrial and academic institutions around the world share their expertise and experience with techniques such as image correlation, light scattering, scanning probe microscopy, confocal microscopy, fringe projection, grid and moire techniques, interference microscopy, laser Doppler vibrometry, holography, speckle metrology, and spectroscopy. They also examine modern approaches to data acquisition and processing. The book emphasizes the evaluation of various properties to increase reliability and promote a consistent approach to optical testing. Numerous practical examples and illustrations reinforce the concepts.
Supplying advanced tools for microsystem manufacturing and characterization, Optical Inspection of Microsystems enables you to reach toward a higher level of quality and reliability in modern micro-scale applications.
目次
- Image Processing and Computer Vision for MEMS Testing
- Markus Huttel Introduction Classification of Tasks Image Processing and Computer Vision Components Processing and Analysis of Image Data Commercial and Noncommercial Image Processing and Computer Vision Software Image Processing Techniques for the Processing of Fringe Patterns in Optical Metrology Conclusion References Image Correlation Techniques for Microsystems Inspection
- Dietmar Vogel and Bernd Michel Introduction Deformation Measurement by Digital Image Correlation (DIC) Techniques Base Equipment for DIC Applications Applications of DIC Techniques to Microsystems Conclusions and Outlook References Light Scattering Techniques for the Inspection of Microcomponents and Microstructures
- Angela Duparre Introduction Theoretical Background of Light Scattering Measurement Equipment Standardization of Light Scattering Methods Applications for Microcomponent and Microstructure Inspection Combination of Light Scattering and Profilometric Techniques Conclusions and Outlook References Characterization and Measurement of Microcomponents with the Atomic Force Microscope (AFM)
- F. Michael Serry and Joanna Schmit Introduction Components of AFM and Principles of AFM Operation AFM Imaging Modes AFM Nonimaging Modes Applications of AFM for Microcomponent Inspection: A Case Study Atomic Force Profilometer (AFP) - A Combination of AFM and Stylus Profiler Optical Metrology Complementary to AFM Conclusions and Outlook References Optical Profiling Techniques for MEMS Measurement
- Klaus Koerner, Aiko Ruprecht, and Tobias Wiesendanger Introduction Principles of Confocal Microscopy Principle of Microscopic Depth-Scanning Fringe Projection (DSFP) Conclusion References Grid and Moire Methods for Micromeasurements
- Anand Asundi, Bing Zhao, and Huimin Xie Introduction Grid or Grating Fabrication Methods Micro-Moire Interferometer Moire Methods Using High-Resolution Microscopy Microscopic Grid Methods Conclusions References Grating Interferometry for In-Plane Displacement and Strain Measurement of Microcomponents
- Leszek Salbut Introduction Principle of Grating Interferometry Waveguide Grating Interferometry Measurement System SG Technology Exemplary Applications of WGI Conclusions References Interference Microscopy Techniques for Microsystem Characterization
- Alain Bosseboeuf and Sylvain Petitgrand Introduction Interference Microscopes Modeling of Two-Beam Homodyne Interference Microscopes Static Measurements by Interference Microscopy Performance and Issues of Interference Microscopy Applications of Interferometric Profilometers in the MEMS Field Dynamic Measurements by Interference Microscopy Conclusion Acknowledgments References Measuring MEMS in Motion by Laser Doppler Vibrometry
- Christian Rembe, Georg Siegmund, Heinrich Steger, and Michael Woertge Introduction Laser Doppler Effect and Its Interferometric Detection Techniques of Laser Doppler Vibrometry Full-Field Vibrometry Measuring on Microscopic Structures Resolution and Accuracy Combination with Other Techniques Examples Conclusion and Outlook References An Interferometric Platform for Static, Quasi-Static, and Dynamic Evaluation of Out-Of-Plane Deformations of MEMS and MOEMS
- Christophe Gorecki, Michal Jozwik, and Patrick Delobelle Introduction Interferometric Platform Architecture and Principle of Operation Optomechanical Characterization of Membranes by "Pointwise" Deflection Method Mechanical Expertise of Scratch Drive Actuators via Interferometric Measurement of Out-of-Plane Microdisplacements Dynamic Evaluation of Active MOEMS by Interferometry Using Stroboscopic Technique General Conclusion and Outlook Acknowledgments References Optoelectronic Holography for Testing Electronic Packaging and MEMS
- Cosme Furlong Introduction Overview of MEMS Fabrication Processes Optoelectronic Holography Representative Applications Summary Acknowledgments References Digital Holography and Its Application in MEMS/MOEMS Inspection
- Wolfgang Osten and Pietro Ferraro Introduction Theory and Basic Principle of Digital Holography (DH) Digital Holographic Interferometry Digital Holographic Microscopy (DHM) The Application of DH to the Investigation of Microcomponents Conclusion References Speckle Metrology for Microsystem Inspection
- Roland Hoefling and Petra Aswendt Introduction Basics Applications Conclusion References Spectroscopic Techniques for MEMS Inspection
- Ingrid De Wolf Introduction Raman Spectroscopy (RS) Spectroscopic Ellipsometry (SE) Dual-Beam Spectroscopy (DBS) X-Ray Photoelectron Spectroscopy (XPS) High-Resolution Electron Energy Loss Spectroscopy (HREELS) Auger Electron Spectroscopy (AES) Brillouin Scattering (BS) Conclusions References Index
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