Copper interconnects, new contact and barrier metallurgies/structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USA
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Copper interconnects, new contact and barrier metallurgies/structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USA
（ECS transactions, vol. 1,
Electrochemical Society, c2006
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"Sponsoring Divisions: Dielectric Science and Technology, Electronics and Photonics, Electrodeposition."
Includes bibliographical references and indexes
