Lead-free electronics
著者
書誌事項
Lead-free electronics
Wiley-Interscience, c2006
大学図書館所蔵 全1件
  青森
  岩手
  宮城
  秋田
  山形
  福島
  茨城
  栃木
  群馬
  埼玉
  千葉
  東京
  神奈川
  新潟
  富山
  石川
  福井
  山梨
  長野
  岐阜
  静岡
  愛知
  三重
  滋賀
  京都
  大阪
  兵庫
  奈良
  和歌山
  鳥取
  島根
  岡山
  広島
  山口
  徳島
  香川
  愛媛
  高知
  福岡
  佐賀
  長崎
  熊本
  大分
  宮崎
  鹿児島
  沖縄
  韓国
  中国
  タイ
  イギリス
  ドイツ
  スイス
  フランス
  ベルギー
  オランダ
  スウェーデン
  ノルウェー
  アメリカ
注記
Includes bibliographical references and index
HTTP:URL=http://www.loc.gov/catdir/enhancements/fy0626/2005057518-d.html Information=Publisher description
HTTP:URL=http://www.loc.gov/catdir/enhancements/fy0650/2005057518-b.html Information=Contributor biographical information
内容説明・目次
内容説明
Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed:
* Complying with state legislation
* Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues
* Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement
* Implementing cost effective manufacturing and testing
* Reducing risks due to tin whiskers
* Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries
* Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects
* Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products
Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach.
With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.
目次
Preface. Editors.
Contributors.
Acknowledgements.
Chapter 1. Lead-Free Electronics: Overview.
Chapter 2. Lead-Free Legislations, Exemptions & Compliance.
Chapter 3. Lead-Free Alloys: Overview.
Chapter 4. Lead-Free Manufacturing.
Chapter 5. Review of Lead-Free Solder Joint Reliability.
Chapter 6. Constitutive Properties and Durability of Selected Lead-Free Solders.
Chapter 7. Interfacial Reactions and Performance of Lead-Free Solder Joints.
Chapter 8. Conductive Adhesives.
Chapter 9. Component-Level Issues in Lead-Free Electronics.
Chapter 10. Tin Whiskers in Electronics.
Chapter 11. Lead-Free Separable Contacts and Connectors.
Chapter 12 Intellectural Property.
Chapter 13. Costs to Lead-Free Migration.
Chapter 14. Lead-Free Technologies in the Japanese Electronics Industry.
Chapter 15. Guidelines for Implementing Lead-Free Electronics.
Index.
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