{"@context":{"owl":"http://www.w3.org/2002/07/owl#","bibo":"http://purl.org/ontology/bibo/","foaf":"http://xmlns.com/foaf/0.1/","rdfs":"http://www.w3.org/2000/01/rdf-schema#","prism":"http://prismstandard.org/namespaces/basic/2.0/","cinii":"http://ci.nii.ac.jp/ns/1.0/","dc":"http://purl.org/dc/elements/1.1/","dcterms":"http://purl.org/dc/terms/"},"@id":"https://ci.nii.ac.jp/ncid/BA81457888.json","@graph":[{"@id":"https://ci.nii.ac.jp/ncid/BA81457888#entity","@type":"bibo:Book","foaf:isPrimaryTopicOf":{"@id":"https://ci.nii.ac.jp/ncid/BA81457888.json"},"dc:title":[{"@value":"Proceedings of the 4th International Conference on Nanochannels, Microchannels and Minichannels-- 2006 : presented at 4th International Conference on Nanochannels, Microchannels and Minichannels, June 19-21, 2006, Limerick, Ireland"}],"dcterms:alternative":["2006 Proceedings of the 4th International Conference on Microchannels and Minichannels, ICNMM2006","ICNMM2006","4th International Conference on Nanochannels, Microchannels and Minichannels","Nanochannels, microchannels and minichannels"],"dc:creator":"sponsored by ASME","dc:publisher":[{"@value":"American Society of Mechanical Engineers"}],"dcterms:extent":"2 v. (xxv, 1394 p.)","cinii:size":"28 cm","dc:language":"eng","dc:date":"2006","cinii:ncid":"BA81457888","cinii:ownerCount":"1","foaf:maker":[{"@type":"foaf:Person","foaf:name":[{"@value":"International Conference on Nanochannels, Microchannels and Minichannels"}]},{"@id":"https://ci.nii.ac.jp/author/DA01706933#entity","@type":"foaf:Person","foaf:name":[{"@value":"American Society of Mechanical Engineers"}]}],"bibo:owner":[{"@id":"https://ci.nii.ac.jp/library/FA000106","@type":"foaf:Organization","foaf:name":"東京科学大学 大岡山図書館","rdfs:seeAlso":{"@id":"https://topics.libra.titech.ac.jp/recordID/catalog.bib/BA81457888"}}],"bibo:lccn":["2007295373"],"rdfs:seeAlso":[{"@id":"https://lccn.loc.gov/2007295373"}],"prism:publicationDate":["c2006"],"cinii:note":["Includes bibliographic references and author index"],"dc:subject":["LCC:TJ853","DC22:629.8/042"],"cinii:contentOfWorks":["Pt. A: Biomedical, boiling, condensation, device/system integration, electrokinetic flows, electronics cooling, gas flow, heat transfer, lab-on-chip","Pt. B: Single-phase liquid flow, microfluidics, micro-heat exchangers, micromixers, nanofluidics, novel applications, optics, two-phase flow, keynote papers"],"foaf:topic":[{"@id":"https://ci.nii.ac.jp/books/search?q=Fluidic+devices+--+Congresses","dc:title":"Fluidic devices -- Congresses"},{"@id":"https://ci.nii.ac.jp/books/search?q=Microfluidics+--+Congresses","dc:title":"Microfluidics -- Congresses"},{"@id":"https://ci.nii.ac.jp/books/search?q=Microelectromechanical+systems+--+Congresses","dc:title":"Microelectromechanical systems -- Congresses"},{"@id":"https://ci.nii.ac.jp/books/search?q=Heat+--+Transmission+--+Congresses","dc:title":"Heat -- Transmission -- Congresses"},{"@id":"https://ci.nii.ac.jp/books/search?q=Heat+sinks+%28Electronics%29+--+Congresses","dc:title":"Heat sinks (Electronics) -- Congresses"}],"dcterms:hasPart":[{"@id":"urn:isbn:0791847608","dc:title":": set"},{"dc:title":"Pt. A"},{"dc:title":"Pt. B"}]}]}