High power diode lasers : technology and applications
著者
書誌事項
High power diode lasers : technology and applications
(Springer series in optical sciences, 128)
Springer, c2007
大学図書館所蔵 全8件
  青森
  岩手
  宮城
  秋田
  山形
  福島
  茨城
  栃木
  群馬
  埼玉
  千葉
  東京
  神奈川
  新潟
  富山
  石川
  福井
  山梨
  長野
  岐阜
  静岡
  愛知
  三重
  滋賀
  京都
  大阪
  兵庫
  奈良
  和歌山
  鳥取
  島根
  岡山
  広島
  山口
  徳島
  香川
  愛媛
  高知
  福岡
  佐賀
  長崎
  熊本
  大分
  宮崎
  鹿児島
  沖縄
  韓国
  中国
  タイ
  イギリス
  ドイツ
  スイス
  フランス
  ベルギー
  オランダ
  スウェーデン
  ノルウェー
  アメリカ
注記
Includes bibliographical references and index
内容説明・目次
内容説明
This book summarizes a five year research project, as well as subsequent results regarding high power diode laser systems and their application in materials processing. The text explores the entire chain of technology, from the semiconductor technology, through cooling mounting and assembly, beam shaping and system technology, to applications in the processing of such materials as metals and polymers. Includes theoretical models, a range of important parameters and practical tips.
目次
1Motivation and introduction 2High power diode laser technlogy and characteristics 2.1Principles of diode operation 2.2Manufacturing technology 2.3Chip characterization methods and operation 2.4Broad area emitters and arrays 2.5High brightness emitters and arrays 3Packaging of diode laser bars 3.1General aspects 3.2Mounting of diode laser bars 3.3Cooling 3.3.1Introduction 3.3.2 Conduction cooling 3.3.3Micro-channel heatsinks 3.3.4Heatspreaders 3.4Expansion-matched packages 3.5Mounting of micro-optics 4Stacking and incoherent superposition 4.1 Introduction and Survey 4.2 Beam collimation 4.3 Techniques for Beam Combination 4.4 Stacking Techniques 4.5 Beam symmetrization and fiber coupling 4.6 Beam-Quality limits and comparison to coherent coupling 5 Laser systems: beam characteristics, metrology and standards 5.1 Introdiuction 5.2 Theoretical background of beam propagation 5.2.1 Preliminaries 5.2.2 Temporal integration, coherence 5.2.3 Wigner distribution 5.2.4 Propagation of the Wigner distribution through linear optical systems 5.3 Density distribution 5.3.1 Power density distribution in the far field 5.3.2 Width of a power density distribution in a transverse plane 5.4 Propagation of the beam width 5.4.1 Theoretical background 5.4.2 Beam classification 5.4.3 Propagation of the beam width of stigmatic and simple astigmatic beams 5.5. Measurement of the beam power 5.6 Measurement of the power density distribution and the beam propagation ratio, M(2) 5.6.1 Camera systems 5.6.2 Mechanical scanning devices 5.6.3 Measuring beam caustics 5.6.4 Power density in the far field measurement 5.6.5 Evaluating the widths of ameasured power density distribution 5.6.6 Determination of the beam propagation ration, M(2) 5.7 Beam positional stability 5.8 Wavefront of a laser 5.9 Lifetime 5.10 Table of international standards related to laser metrology 5.11 References 6 Diode laser systems 6.1 Introduction 6.2 Multi purpose laser systems 6.2.1 Optical cutting plotter with 100 W 6.2.2 Free space propagation systems in the kW range 6.2.3 Fibre coupled system in the kW range 6.2.4 High brightness system with 100 W 6.2.5 High brightness kW system 6.3 Modular diode laser systems 6.3.1 Soldering laser, integrated into a gripping tool - pick and join 6.3.2 Individually addressable intensity line 6.3.3 Line modules for contour adapted plastics welding 6.3.4 Diode laser line cutter 6.3.5 Annular diode laser tool 6.3.6 Process controlling modular diode laser system for transformation hardening 6.3.7 Ring shaped laser for laser assisted machining 6.4 List of symbols 6.5 References 7 Applications 7.1 Joining technologies 7.1.1 Introduction 7.1.2 Metal welding 7.1.3 Brazing 7.1.4 Soldering 7.1.5 Laser Beam Welding of Thermoplastics 7.1.6 References 7.2 Cutting and laser assisted machining technologies 7.2.1 Introduction 7.2.2 Precision cutting with the optical cutting plotter 7.2.3 Single-shot cutting-to-length 7.2.4 Oxygen cutting with annular beam 7.2.5 Laser asisted machining 7.3 Surface treatment 7.3.1 Introduction 7.3.2 Hardening 7.3.2.1 Process principles and equipment 7.3.2.1.1 Differences between / principles of hardening and remelting 7.3.2.1.2 Absorption depending on angle of incidence, material, surface roughness,
「Nielsen BookData」 より