Semiconductor Wafer Bonding : Science, Technology, and Applications

Author(s)

• International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications
• Baumgart, H.
• Electrochemical Society. Electronics Division

Bibliographic Information

Semiconductor Wafer Bonding : Science, Technology, and Applications

editors, H. Baumgart ... [et al.] ; sponsoring division, Electronics and Photonics

（ECS transactions, vol. 3, no. 6, vol. 16, no. 8）

Electrochemical Society, c2006-

• 9
• 10

Note

"... held in Cancun, Mexico, as part of the 2006 Fall Meeting of The Electrochemical Society" -- 9

"... held in Honolulu, Hawaii, on October 14-16, 2008, as a part of the Pacific Rim Meeting, PRiME 2008: joint International Meeting of the 214th Meeting of ECS-The Electrochemical Society, and the 2008 Fall Meeting of The Electrochemical Society of Japan" -- 10

Includes bibliographical references and indexes

Details

• NCID: BA81682895
• ISBN:
  • 156677506X
  • 9781566776547
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Pennington, N.J.
• Pages/Volumes: v.
• Size: 23 cm
• Parent Bibliography ID:
  • BA78566502