EMAP 2005 : 2005 International Symposium on Electronics Materials and Packaging : December 11-14, 2005, Tokyo Institute of Technology, Tokyo, Japan

Author(s)

Bibliographic Information

EMAP 2005 : 2005 International Symposium on Electronics Materials and Packaging : December 11-14, 2005, Tokyo Institute of Technology, Tokyo, Japan

IEEE, c2005

Other Title

Proceedings : EMAP 2005 : 2005 International Symposium on Electronics Materials and Packaging, December 11-14, 2005, Tokyo Institute of Technology, Tokyo, Japan

7th International Conference on Electronics Materials and Packaging

EMAP '05

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Note

Sponsors: COE21, Tokyo Institute of Technology, CASIO Science Promotion Foundation, The Kao Foundation for Arts and Sciences

General Chair: Kikuo Kishimoto

"The 7th International Conference on Electronics Materials and Packaging ..." -- on pref

IEEE catalog number: 05EX1277

Details

  • NCID
    BA83240388
  • LCCN
    2006276755
  • Country Code
    us
  • Title Language Code
    eng
  • Text Language Code
    eng
  • Place of Publication
    Piscataway, NJ
  • Pages/Volumes
    vi, 301 p.
  • Size
    30 cm
  • Classification
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