Physics design-reliability and packaging

Author(s)

• Suhir, Ephraim
• Lee, Yung-Cheng
• Wong, C. P.

Bibliographic Information

Physics design-reliability and packaging

edited by E. Suhir, Y. C. Lee, C. P. Wong

（Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging / edited by E. Suhir, Y. C. Lee, C. P. Wong, v. 2）

Springer, c2007

Other Title

Physics design reliability and packaging

Note

Includes bibliographical references and index

Details

• NCID: BA83437644
• ISBN:
  • 9780387279749
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: xxx, 735 p.
• Size: 26 cm
• Parent Bibliography ID:
  • BA8343751X