System-in-package RF design and applications
著者
書誌事項
System-in-package RF design and applications
（The Artech House microwave library）
Artech House, c2007
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注記
Includes bibliographical references and index
内容説明・目次
内容説明
In the past few years, System in Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. Here's the first comprehensive resource on SiP design techniques that offers designers state-of-the-art packaging know-how. Moreover, the book provides numerous examples that illustrate real-world capabilities, constraints, trade-offs, and options at every step.
目次
Introduction. LTCC versus Laminate. Assembly Process. TX and RX Architecture. RF Components. Filters. Other Passive Circuits. Active Circuit Design. Oscillators and Synthesizers. Advanced Packaging Techniques (Designs). Advanced RF Design Techniques.
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