Proceedings of the Symposium on Polymeric Materials for Electronic Packaging and High Technology Applications

Author(s)

• Symposium on Polymeric Materials for Electronic Packaging and High Technology Applications
• Susko, J. R. (John R.)
• Snyder, R. W. (Randy W.)
• Susko, R. A. (Robin A.)
• Electrochemical Society. Dielectrics and Insulation Division
• Electrochemical Society. Electronics Division

Bibliographic Information

Proceedings of the Symposium on Polymeric Materials for Electronic Packaging and High Technology Applications

edited by J.R. Susko, R.W. Snyder, R.A. Susko ; [sponsored by] Dielectrics and Insulation and Electronics divisions

（Proceedings / [Electrochemical Society], v. 88-17）

Electrochemical Society, c1988

Other Title

Polymeric materials for electronic packaging and high technology applications

Note

Includes bibliographical references and indexes

"... at the Fall meeting October 18-23, 1987, in Honolulu, Hawaii" -- on pref

Details

• NCID: BA84960484
• LCCN: 88082251
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Pennington, NJ
• Pages/Volumes: vi, 213 p.
• Size: 23 cm
• Classification:
  • LCC : TK7874
  • DC20 : 621.381/046
• Subject Headings:
  • LCSH : Integrated circuits -- Very large scale integration -- Congresses
  • LCSH : Electronic packaging -- Congresses
  • LCSH : Polymers -- Congresses
• Parent Bibliography ID:
  • BA01323290