Proceedings of the Symposium on Packaging of Electronic Devices

著者

• Symposium on Packaging of Electronic Devices
• Electrochemical Society. Meeting
• Bindra, P.
• Susko, R. A. (Robin A.)
• Electrochemical Society. Dielectrics and Insulation Division
• Electrochemical Society. Electrodeposition Division
• Electrochemical Society. Electronics Division

書誌事項

Proceedings of the Symposium on Packaging of Electronic Devices

edited by P. Bindra, R.A. Susko ; [sponsored by] Dielectrics and Insulation, Electrodeposition, and Electronics Divisions

（Proceedings / [Electrochemical Society], v. 89-3）

Electrochemical Society, c1989

タイトル別名

Packaging of electronic devices

注記

Includes bibliographical references and indexes

"... held at the Spring Meeting of the Electrochemical Society, May 17-18, 1988 in Atlanta, Georgia" -- on pref

詳細情報

• NII書誌ID(NCID): BA8496515X
• LCCN: 89083686
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Pennington, NJ
• ページ数/冊数: vii, 249 p.
• 大きさ: 23 cm
• 分類:
  • LCC : TK7870
  • DC20 : 621.381/046
• 件名:
  • LCSH : Electronic packaging -- Congresses
• 親書誌ID:
  • BA01323290