Electronic assembly fabrication : chips, circuit boards, packages, and components

Author(s)

• Harper, Charles A.

Bibliographic Information

Electronic assembly fabrication : chips, circuit boards, packages, and components

Charles A. Harper, editor-in-chief

（McGraw-Hill professional engineering）（Electronic packaging and interconnection series）

McGraw-Hill, c2002

Note

Includes bibliographical references and index

Details

• NCID: BA85473897
• ISBN:
  • 0071378820
• LCCN: 2002022737
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: xv, 672 p.
• Size: 24 cm
• Classification:
  • LCC : TK7870
  • DC21 : 621.381
• Subject Headings:
  • LCSH : Electronic apparatus and appliances -- Design and construction
• Parent Bibliography ID:
  • BA49261964
  • BA23068517