Design, characterization, and packaging for MEMS and microelectronics II : 17-19 December, 2001, Adelaide, Australia
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Design, Characterization, and Packaging for MEMS and Microelectronics (Conference)
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United States. Air Force. Asian Office of Aerospace Research and Development
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Institute of Electrical and Electronics Engineers. South Australia Section
Author(s)
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Design, Characterization, and Packaging for MEMS and Microelectronics (Conference)
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United States. Air Force. Asian Office of Aerospace Research and Development
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Institute of Electrical and Electronics Engineers. South Australia Section
Bibliographic Information
Design, characterization, and packaging for MEMS and microelectronics II : 17-19 December, 2001, Adelaide, Australia
Paul D. Frnazon, chair/editor ; sponsored and published by SPIE--the International Society for Optical Engineering ; cosponsored by U.S. Air Force Office of Scientific Research, Asian Office of Aerospace Research and Development ... [et al.] ; cooperating organization IEEE South Australia Section
(Proceedings / SPIE -- the International Society for Optical Engineering, v. 4593)
SPIE, c2001
Available at / 1 libraries
Note
Includes bibliographic references and author index
Related Books: 1-1 of 1
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1
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Proceedings
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SPIE -- the International Society for Optical Engineering
SPIE -- the International Society for Optical Engineering