15th Symposium on "Microjoining and Assembly Technology in Electronics", January 29-30 2009, Yokohama

Author(s)

Bibliographic Information

15th Symposium on "Microjoining and Assembly Technology in Electronics", January 29-30 2009, Yokohama

溶接学会, 2009.1

Other Title

Mate 2009

第15回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.15, 2009

Proceedings of the 15th Symposium on Microjoining and Assembly Technology in Electronics, vol.15, 2009

Available at  / 2 libraries

Note

Sponsored by Microjoining Commission (JWS)

参考文献あり

Details

  • NCID
    BA89272988
  • ISBN
    • 9784906110148
  • Country Code
    ja
  • Title Language Code
    eng
  • Text Language Code
    jpneng
  • Place of Publication
    東京
  • Pages/Volumes
    402p
  • Size
    30cm
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