Advanced Metallization Conference 1999 (AMC 1999) : proceedings of the conference held September 28-30, 1999, in Orlando, Florida, sponsored by Continuing Education in Engineering, University Extension, University of California at Berkeley, California, U.S.A. An Asian session of this conference was held October 14-15, 1999, in Tokyo, Japan
著者
書誌事項
Advanced Metallization Conference 1999 (AMC 1999) : proceedings of the conference held September 28-30, 1999, in Orlando, Florida, sponsored by Continuing Education in Engineering, University Extension, University of California at Berkeley, California, U.S.A. An Asian session of this conference was held October 14-15, 1999, in Tokyo, Japan
（Materials Research Society conference proceedings）
Materials Research Society, c2000
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注記
Includes bibliographical references and indexes
Other editors: Thomas Gessner, N. Kobayashi, Y. Yasuda
内容説明・目次
内容説明
The revolution in materials and processes for IC metallization presents exciting challenges for the future. This book, the 16th in a popular series from MRS, provides a forum within the IC metallization community, across industrial, academic and government institutions, for presentation and discussion of leading-edge research, development and technology. In particular, the volume focuses on Cu and low-k dielectrics spanning materials, properties, processing, integration and reliability. Two keynote addresses are featured - one on 'The MARCO/DARPA Interconnect Focus Cente' a cooperative research program involving several top universities in the U.S. whose mission it is to explore new interconnect strategies for the future, the other on 'Low-Cost and High-Performance DRAM Technology'. Additional topics include: integration of damascene architectures; copper-deposition processes and properties; barriers for copper; low-k dielectrics; aluminum, tungsten and DRAM metallization; silicides; CMP/cleaning/etching; process modeling and reliability.
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