{"@context":{"owl":"http://www.w3.org/2002/07/owl#","bibo":"http://purl.org/ontology/bibo/","foaf":"http://xmlns.com/foaf/0.1/","rdfs":"http://www.w3.org/2000/01/rdf-schema#","prism":"http://prismstandard.org/namespaces/basic/2.0/","cinii":"http://ci.nii.ac.jp/ns/1.0/","dc":"http://purl.org/dc/elements/1.1/","dcterms":"http://purl.org/dc/terms/"},"@id":"https://ci.nii.ac.jp/ncid/BB00848183.json","@graph":[{"@id":"https://ci.nii.ac.jp/ncid/BB00848183#entity","@type":"bibo:Book","foaf:isPrimaryTopicOf":{"@id":"https://ci.nii.ac.jp/ncid/BB00848183.json"},"dc:title":[{"@value":"最先端高密度配線銅めっき技術"},{"@value":"サイセンタン コウミツド ハイセン ドウメッキ ギジュツ","@language":"ja-hrkt"}],"dcterms:alternative":["Advanced copper plating wiring technology","エレクトロニクスシリーズ"],"dc:creator":"半導体新技術研究会編 ; 早瀬仁則監修","dc:publisher":[{"@value":"シーエムシー出版"}],"dcterms:extent":"vi, 273p","cinii:size":"27cm","dc:language":"jpn","dc:date":"2009","cinii:ncid":"BB00848183","cinii:ownerCount":"10","foaf:maker":[{"@type":"foaf:Person","foaf:name":[{"@value":"半導体新技術研究会"},{"@value":"ハンドウタイ シンギジュツ ケンキュウカイ","@language":"ja-hrkt"}]},{"@type":"foaf:Person","foaf:name":[{"@value":"早瀬, 仁則"},{"@value":"ハヤセ, マサノリ","@language":"ja-hrkt"}]}],"bibo:owner":[{"@id":"https://ci.nii.ac.jp/library/FA02165X","@type":"foaf:Organization","foaf:name":"東北大学 多元物質科学研究所 図書室","rdfs:seeAlso":{"@id":"http://opac.library.tohoku.ac.jp/opac/opac_openurl/?ncid=BB00848183"}},{"@id":"https://ci.nii.ac.jp/library/FA001914","@type":"foaf:Organization","foaf:name":"東京農工大学 小金井図書館","rdfs:seeAlso":{"@id":"https://libwebservice.biblio.tuat.ac.jp/opac/opac_openurl/?ncid=BB00848183"}},{"@id":"https://ci.nii.ac.jp/library/FA000117","@type":"foaf:Organization","foaf:name":"東京科学大学 すずかけ台図書館","rdfs:seeAlso":{"@id":"https://topics.libra.titech.ac.jp/recordID/catalog.bib/BB00848183"}},{"@id":"https://ci.nii.ac.jp/library/FA005642","@type":"foaf:Organization","foaf:name":"拓殖大学 八王子図書館","rdfs:seeAlso":{"@id":"https://opac.lib.takushoku-u.ac.jp/opac/search?target=local&searchmode=complex&autoDetail=true&s_ncid=BB00848183"}},{"@id":"https://ci.nii.ac.jp/library/FA005802","@type":"foaf:Organization","foaf:name":"東海大学 付属図書館","rdfs:seeAlso":{"@id":"https://opac-t.time.u-tokai.ac.jp/iwjs0018opc/ufirdi.do?ufi_target=ctlsrh&ncid=BB00848183"}},{"@id":"https://ci.nii.ac.jp/library/FA006678","@type":"foaf:Organization","foaf:name":"明治大学 図書館","rdfs:seeAlso":{"@id":"https://opac2018.lib.meiji.ac.jp/webopac/ufirdi.do?ufi_target=ctlsrh&ncid=BB00848183"}},{"@id":"https://ci.nii.ac.jp/library/FA007251","@type":"foaf:Organization","foaf:name":"愛知工業大学 附属図書館","rdfs:seeAlso":{"@id":"https://opac.aitech.ac.jp/iwjs0007opc/ufirdi.do?ufi_target=ctlsrh&ncid=BB00848183"}},{"@id":"https://ci.nii.ac.jp/library/FA007852","@type":"foaf:Organization","foaf:name":"大阪産業大学 綜合図書館","rdfs:seeAlso":{"@id":"https://library.cnt.osaka-sandai.ac.jp/gate?module=search&path=search&method=search&searchForm.library=true&searchForm.orderNumber=BB00848183"}},{"@id":"https://ci.nii.ac.jp/library/FA008050","@type":"foaf:Organization","foaf:name":"近畿大学 工学部図書館","rdfs:seeAlso":{"@id":"https://opac.clib.kindai.ac.jp/opac/opac_openurl/?ncid=BB00848183"}},{"@id":"https://ci.nii.ac.jp/library/FA022856","@type":"foaf:Organization","foaf:name":"宮城大学 学術情報センター 太白キャンパス図書館","rdfs:seeAlso":{"@id":"https://lib.myu.ac.jp/opac/complexsearch/"}}],"prism:publicationDate":["2009.11"],"cinii:note":["その他のタイトルはジャケットによる"],"dc:subject":["NDC9:549.8","NDLC:ND371"],"foaf:topic":[{"@id":"https://ci.nii.ac.jp/books/search?q=%E5%8D%8A%E5%B0%8E%E4%BD%93","dc:title":"半導体"},{"@id":"https://ci.nii.ac.jp/books/search?q=%E3%82%81%E3%81%A3%E3%81%8D","dc:title":"めっき"}],"dcterms:hasPart":[{"@id":"urn:isbn:9784781301433"}]}]}