Science and technology of chemical mechanical planarization (CMP) : symposium held April 14-16, 2009, San Francisco, California, U.S.A.

Author(s)

Bibliographic Information

Science and technology of chemical mechanical planarization (CMP) : symposium held April 14-16, 2009, San Francisco, California, U.S.A.

editors: Ashok Kumar ... [et al.]

(Materials Research Society symposium proceedings, v. 1157)

Materials Research Society, c2010

Available at  / 2 libraries

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Note

Other editors: C. Fred Higgs III, Chad S. Korach, Subramanian Balakumar

Includes bibliographical references and indexes

"..., 'Science and technology of chemical mechanical planarization (CMP),' held April 14-16 at the 2009 MRS Spring Meeting in San Francisco, California."--Pref.

Description and Table of Contents

Description

This book demonstrates the swift progress achieved in the field of diamond for electronic and bioelectronic applications. Predicted to become the 'ultimate semiconductor' in the early 1990s, diamond initially failed to match the impressive developments made with other wide-bandgap semiconductors. The situation is changing, with single-crystal electronic-grade diamond becoming a commercially available material. As importantly, the spectacular properties of single-point defects in diamond, as well as its superlative thermal conductivity, radiation 'hardness' and inherent biocompatibility, are being recognized as vital for devices used in biosensing, quantum informatics, and environmentally challenging applications. Not all recent advances relate to single-crystal diamond. Nanocrystalline diamond (NCD), ultra-nanocrystalline diamond (UNCD) and diamond-like carbon (DLC) are very important forms of carbon, as are multiphase carbon nanostructures and graphene. It features results in all areas of high-performance diamond research. Chemical, electrochemical, and biochemical sensing, including nanodiamond for sensing in-cellular environment and the integration of diamond within biological systems are highlighted.

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Details

  • NCID
    BB0223199X
  • ISBN
    • 9781605111308
  • Country Code
    us
  • Title Language Code
    eng
  • Text Language Code
    eng
  • Place of Publication
    Warrendale, Pa.
  • Pages/Volumes
    ix, 165 p.
  • Size
    24 cm
  • Parent Bibliography ID
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