Lead-free solder interconnect reliability

Author(s)

• Shangguan, Dongkai

Bibliographic Information

Lead-free solder interconnect reliability

edited by Dongkai Shangguan

ASM International, 2005

Note

Description based on 2nd printing, 2006

Includes bibliographical references and index

Details

• NCID: BB03838572
• ISBN:
  • 9780871708168
• LCCN: 2005050106
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Materials Park, OH
• Pages/Volumes: x, 292 p.
• Size: 27 cm
• Classification:
  • LCC : TK7870.15
  • DC22 : 621.381/046
• Subject Headings:
  • LCSH : Microelectronic packaging -- Reliability
  • LCSH : Solder and soldering
  • LCSH : Lead-free electronics manufacturing processes