Lead-free solder interconnect reliability

著者

• Shangguan, Dongkai

書誌事項

Lead-free solder interconnect reliability

edited by Dongkai Shangguan

ASM International, 2005

注記

Description based on 2nd printing, 2006

Includes bibliographical references and index

• NII書誌ID(NCID): BB03838572
• ISBN:
  • 9780871708168
• LCCN: 2005050106
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Materials Park, OH
• ページ数/冊数: x, 292 p.
• 大きさ: 27 cm
• 分類:
  • LCC : TK7870.15
  • DC22 : 621.381/046
• 件名:
  • LCSH : Microelectronic packaging -- Reliability
  • LCSH : Solder and soldering
  • LCSH : Lead-free electronics manufacturing processes