A guide to lead-free solders : physical metallurgy and reliability
著者
書誌事項
A guide to lead-free solders : physical metallurgy and reliability
Springer, c2007
- : hardcover
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注記
Includes bibliographical references and index
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内容説明・目次
内容説明
The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.
目次
to Solder Alloys and Their Properties.- Packaging Architecture and Assembly Technology.- Wetting and Joint Formation.- Microstructural Instability in Solders.- Intermetallic Formation and Growth.- Mechanical Properties and Creep Behavior.- Thermomechanical Fatigue.- Product Assurance.
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