16th Symposium on "Microjoining and Assembly Technology in Electronics", February 2-3 2010, Yokohama

Author(s)

Bibliographic Information

16th Symposium on "Microjoining and Assembly Technology in Electronics", February 2-3 2010, Yokohama

溶接学会, 2010.2

Other Title

Mate 2010

第16回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.16, 2010

Proceedings of the 16th Symposium on Microjoining and Assembly Technology in Electronics, vol.16, 2010

Available at  / 2 libraries

Note

Sponsored by Microjoining Commission (JWS)

参考文献あり

Details

  • NCID
    BB04973303
  • ISBN
    • 9784906110155
  • Country Code
    ja
  • Title Language Code
    eng
  • Text Language Code
    jpneng
  • Place of Publication
    東京
  • Pages/Volumes
    450p
  • Size
    30cm
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