3-dimensional VLSI : a 2.5-dimensional integration scheme
著者
書誌事項
3-dimensional VLSI : a 2.5-dimensional integration scheme
Tsinghua University Press , Springer, c2010
- : Tsinghua
- : Springer
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注記
Based on the first author's thesis (Ph.D.) -- Carnegie Mellon University, 2006
内容説明・目次
内容説明
"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D.
Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA.
目次
A Cost Comparison of VLSI Integration Schemes.- Design Case Studies.- An Automatic 2.5-D Layout Design Flow.- Floorplanning for 2.5-D Integration.- Placement for 2.5-D Integration.- A Road map of 2.5-D Integration.- Conclusion and Future Work.
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