Adhesives technology for electronic applications : materials, processing, reliability

著者

• Licari, James J.
• Swanson, Dale W.

書誌事項

Adhesives technology for electronic applications : materials, processing, reliability

James J. Licari and Dale W. Swanson

（Materials and processes for electronic applications series / series editor James J. Licari）

William Andrew/Elsevier, 2011

2nd ed

• : hbk

注記

Includes bibliographical references and index

詳細情報

• NII書誌ID(NCID): BB06825216
• ISBN:
  • 9781437778892
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Waltham, MA
• ページ数/冊数: viii, 403 p.
• 大きさ: 24 cm
• 分類:
  • DC22 : 621.381
  • NDLC : ND351
  • NDLC : PA461
• 件名:
  • LCSH : Electronics -- Materials
  • LCSH : Adhesives
  • LCSH : Electronic packaging
• 親書誌ID:
  • BA71634182