Handbook of wafer bonding

Author(s)

• Ramm, Peter
• Lu, James Jian-Qiang
• Taklo, Maaike M. V.

Bibliographic Information

Handbook of wafer bonding

edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo

Wiley-VCH, c2012

Note

Includes bibliographical references and index

• NCID: BB08069158
• ISBN:
  • 9783527326464
• Country Code: gw
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Weinheim
• Pages/Volumes: xxxi, 395 p.
• Size: 25 cm
• Classification:
  • DC23 : 621.38152
  • LCC : QC611.6.S9
• Subject Headings:
  • LCSH : Semiconductor wafers
  • LCSH : Semiconductors -- Bonding