14th Symposium on Microjoining and Assembly Technology in Electronics, February 5-6 2008, Yokohama

Author(s)

Bibliographic Information

14th Symposium on Microjoining and Assembly Technology in Electronics, February 5-6 2008, Yokohama

溶接学会, 2008.2

Other Title

Mate 2008

第14回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.14, 2008

Proceedings of the 14th Symposium on Microjoining and Assembly Technology in Electronics, vol.14, 2008

Available at  / 1 libraries

Note

Sponsored by Microjoining Commission (JWS)

参考文献あり

Details

  • NCID
    BB0936411X
  • ISBN
    • 9784906110131
  • Country Code
    ja
  • Title Language Code
    eng
  • Text Language Code
    jpneng
  • Place of Publication
    東京
  • Pages/Volumes
    460p
  • Size
    30cm
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