18th Symposium on "Microjoining and Assembly Technology in Electronics", January 31 - February 1 2012, Yokohama

Author(s)

Bibliographic Information

18th Symposium on "Microjoining and Assembly Technology in Electronics", January 31 - February 1 2012, Yokohama

溶接学会, 2012.1

Other Title

Mate 2012

第18回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.18, 2012

Proceedings of the 18th Symposium on Microjoining and Assembly Technology in Electronics, vol.18, 2012

Available at  / 1 libraries

Note

Sponsored by Microjoining Commission (JWS)

参考文献あり

Details

  • NCID
    BB09365597
  • ISBN
    • 9784906110193
  • Country Code
    ja
  • Title Language Code
    eng
  • Text Language Code
    jpneng
  • Place of Publication
    東京
  • Pages/Volumes
    464p
  • Size
    30cm
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