18th Symposium on "Microjoining and Assembly Technology in Electronics", January 31 - February 1 2012, Yokohama

Author(s)
Bibliographic Information

18th Symposium on "Microjoining and Assembly Technology in Electronics", January 31 - February 1 2012, Yokohama

溶接学会, 2012.1

Other Title

Mate 2012

第18回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.18, 2012

Proceedings of the 18th Symposium on Microjoining and Assembly Technology in Electronics, vol.18, 2012

Note

Sponsored by Microjoining Commission (JWS)

参考文献あり

Details
  • NCID
    BB09365597
  • ISBN
    • 9784906110193
  • Country Code
    ja
  • Title Language Code
    eng
  • Text Language Code
    jpneng
  • Place of Publication
    東京
  • Pages/Volumes
    464p
  • Size
    30cm
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