6th Symposium on "Microjoining and Assembly Technology in Electronics", February 3-4 2000, Yokohama

Author(s)

Bibliographic Information

6th Symposium on "Microjoining and Assembly Technology in Electronics", February 3-4 2000, Yokohama

溶接学会 , 高温学会, 2000.2

Other Title

Mate 2000

第6回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集

Proceedings of the 6th Symposium on Microjoining and Assembly Technology in Electronics

Available at  / 1 libraries

Note

Sponsored by Microjoining Commission (JWS), Committee for Information Science in Processing and Recycling (HTSJ)

参考文献あり

Details

  • NCID
    BB09417431
  • ISBN
    • 4906110398
  • Country Code
    ja
  • Title Language Code
    eng
  • Text Language Code
    jpneng
  • Place of Publication
    東京,茨木
  • Pages/Volumes
    366p
  • Size
    30cm
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