RF circuit design
著者
書誌事項
RF circuit design
（Wiley series on information and communications technologies）
John Wiley & Sons, c2012
2nd ed
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注記
Includes bibliographical references and index
内容説明・目次
内容説明
Summarizes the schemes and technologies in RF circuit design, describes the basic parameters of an RF system and the fundamentals of RF system design, and presents an introduction of the individual RF circuit block design. Forming the backbone of today's mobile and satellite communications networks, radio frequency (RF) components and circuits are incorporated into everything that transmits or receives a radio wave, such as mobile phones, radio, WiFi, and walkie talkies. RF Circuit Design, Second Edition immerses practicing and aspiring industry professionals in the complex world of RF design.
Completely restructured and reorganized with new content, end-of-chapter exercises, illustrations, and an appendix, the book presents integral information in three complete sections:
Part One explains the different methodologies between RF and digital circuit design and covers voltage and power transportation, impedance matching in narrow-band case and wide-band case, gain of a raw device, measurement, and grounding. It also goes over equipotentiality and current coupling on ground surface, as well as layout and packaging, manufacturability of product design, and radio frequency integrated circuit (RFIC).
Part Two includes content on the main parameters and system analysis in RF circuit design, the fundamentals of differential pair and common-mode rejection ratio (CMRR), Balun, and system-on-a-chip (SOC).
Part Three covers low-noise amplifier (LNA), power amplifier (PA), voltage-controlled oscillator (VCO), mixers, and tunable filters.
RF Circuit Design, Second Edition is an ideal book for engineers and managers who work in RF circuit design and for courses in electrical or electronic engineering.
目次
PREFACE TO THE SECOND EDITION xix PART 1 DESIGN TECHNOLOGIES AND SKILLS 1
1 DIFFERENCE BETWEEN RF AND DIGITAL CIRCUIT DESIGN 3
1.1 Controversy 3
1.2 Difference of RF and Digital Block in a Communication System 6
1.3 Conclusions 9
1.4 Notes for High-Speed Digital Circuit Design 9
2 REFLECTION AND SELF-INTERFERENCE 15
2.1 Introduction 15
2.2 Voltage Delivered from a Source to a Load 16
2.3 Power Delivered from a Source to a Load 23
2.4 Impedance Conjugate Matching 33
2.5 Additional Effect of Impedance Matching 42
3 IMPEDANCE MATCHING IN THE NARROW-BAND CASE 61
3.1 Introduction 61
3.2 Impedance Matching by Means of Return Loss Adjustment 63
3.3 Impedance Matching Network Built by One Part 68
3.4 Impedance Matching Network Built by Two Parts 74
3.5 Impedance Matching Network Built By Three Parts 84
3.6 Impedance Matching When ZS Or ZL Is Not 50 85
3.7 Parts In An Impedance Matching Network 93
4 IMPEDANCE MATCHING IN THE WIDEBAND CASE 131
4.1 Appearance of Narrow and Wideband Return Loss on a Smith Chart 131
4.2 Impedance Variation Due to the Insertion of One Part Per Arm or Per Branch 136
4.3 Impedance Variation Due to the Insertion of Two Parts Per Arm or Per Branch 145
4.4 Partial Impedance Matching for an IQ (in Phase Quadrature) Modulator in a UWB (Ultra Wide Band) System 151
4.5 Discussion of Passive Wideband Impedance Matching Network 174
5 IMPEDANCE AND GAIN OF A RAW DEVICE 181
5.1 Introduction 181
5.2 Miller Effect 183
5.3 Small-Signal Model of a Bipolar Transistor 187
5.4 Bipolar Transistor with CE (Common Emitter) Configuration 190
5.5 Bipolar Transistor with CB (Common Base) Configuration 204
5.6 Bipolar Transistor with CC (Common Collector) Configuration 214
5.7 Small-Signal Model of a MOSFET 221
5.8 Similarity Between a Bipolar Transistor and a MOSFET 225
5.9 MOSFET with CS (Common Source) Configuration 235
5.10 MOSFET with CG (Common Gate) Configuration 244
5.11 MOSFET with CD (Common Drain) Configuration 249
5.12 Comparison of Transistor Configuration of Single-stage Amplifiers with Different Configurations 252
6 IMPEDANCE MEASUREMENT 259
6.1 Introduction 259
6.2 Scalar and Vector Voltage Measurement 260
6.3 Direct Impedance Measurement by a Network Analyzer 263
6.4 Alternative Impedance Measurement by Network Analyzer 272
6.5 Impedance Measurement Using a Circulator 276
7 GROUNDING 281
7.1 Implication of Grounding 281
7.2 Possible Grounding Problems Hidden in a Schematic 283
7.3 Imperfect or Inappropriate Grounding Examples 284
7.4 'Zero' Capacitor 290
7.5 Quarter Wavelength of Microstrip Line 300
8 EQUIPOTENTIALITY AND CURRENT COUPLING ON THE GROUND SURFACE 325
8.1 Equipotentiality on the Ground Surface 325
8.2 Forward and Return Current Coupling 335
8.3 PCB or IC Chip with Multimetallic Layers 344
9 LAYOUT 349
9.1 Difference in Layout between an Individual Block and a System 349
9.2 Primary Considerations of a PCB 350
9.3 Layout of a PCB for Testing 352
9.4 VIA Modeling 355
9.5 Runner 360
9.6 Parts 369
9.7 Free Space 371
10 MANUFACTURABILITY OF PRODUCT DESIGN 377
10.1 Introduction 377
10.2 Implication of 6 Design 379
10.3 Approaching 6 Design 383
10.4 Monte Carlo Analysis 386
11 RFIC (RADIO FREQUENCY INTEGRATED CIRCUIT) 401
11.1 Interference and Isolation 401
11.2 Shielding for an RF Module by a Metallic Shielding Box 403
11.3 Strong Desirability to Develop RFIC 405
11.4 Interference going along IC Substrate Path 406
11.5 Solution for Interference Coming from Sky 411
11.6 Common Grounding Rules for RF Module and RFIC Design 412
11.7 Bottlenecks in RFIC Design 414
11.8 Calculating of Quarter Wavelength 420
PART 2 RF SYSTEM 427
12 MAIN PARAMETERS AND SYSTEM ANALYSIS IN RF CIRCUIT DESIGN 429
12.1 Introduction 429
12.2 Power Gain 431
12.3 Noise 441
12.4 Nonlinearity 453
12.5 Other Parameters 480
12.6 Example of RF System Analysis 482
13 SPECIALITY OF "'ZERO IF"' SYSTEM 501
13.1 Why Differential Pair? 501
13.2 Can DC Offset be Blocked out by a Capacitor? 508
13.3 Chopping Mixer 511
13.4 DC Offset Cancellation by Calibration 516
13.5 Remark on DC Offset Cancellation 517
14 DIFFERENTIAL PAIRS 521
14.1 Fundamentals of Differential Pairs 521
14.2 CMRR (Common Mode Rejection Ratio) 533
15 RF BALUN 547
15.1 Introduction 547
15.2 Transformer Balun 549
15.3 LC Balun 571
15.4 Microstrip Line Balun 580
15.5 Mixing Type of Balun 583
16 SOC (SYSTEM-ON-A-CHIP) AND NEXT 611
16.1 SOC 611
16.2 What is Next 612
PART 3 INDIVIDUAL RF BLOCKS 625
17 LNA (LOW-NOISE AMPLIFIER) 627
17.1 Introduction 627
17.2 Single-Ended Single Device LNA 628
17.3 Single-Ended Cascode LNA 662
17.4 LNA with AGC (Automatic Gain Control) 684
18 MIXER 695
18.1 Introduction 695
18.2 Passive Mixer 698
18.3 Active Mixer 706
18.4 Design Schemes 717
19 TUNABLE FILTER 731
19.1 Tunable Filter in A Communication System 731
19.2 Coupling between two Tank Circuits 733
19.3 Circuit Description 738
19.4 Effect of Second Coupling 739
19.5 Performance 743
20 VCO (VOLTAGE-CONTROLLED OSCILLATOR) 749
20.1 "Three-Point" Types of Oscillator 749
20.2 Other Single-Ended Oscillators 755
20.3 VCO and PLL (Phase Lock Loop) 759
20.4 Design Example of a Single-Ended VCO 769
20.5 Differential VCO and Quad-Phases VCO 778
21 PA (POWER AMPLIFIER) 789
21.1 Classification of PA 789
21.2 Single-Ended PA 794
21.3 Single-Ended PA IC Design 798
21.4 Push-Pull PA Design 799
21.5 PA with Temperature Compensation 822
21.6 PA with Output Power Control 823
21.7 Linear PA 824
References 828
Further Reading 828
Exercises 829
Answers 829
INDEX 833
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