Advances in CMP/polishing technologies for the manufacture of electronic devices

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書誌事項

Advances in CMP/polishing technologies for the manufacture of electronic devices

edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa

William Andrew : Elsevier, 2012

  • : hbk

タイトル別名

Advances in CMP polishing technologies

CMP polishing technologies for the manufacture of electronic devices : advances in

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注記

On title page: "William Andrew is an imprint of Elsevier"

Includes bibliographical references and index

内容説明・目次

内容説明

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.

目次

Chapter 1: Introduction Chapter 2: Device fabrication with a silicon crystal substrate Chapter 3: Ultra-precision technology - taking silicon single crystal as an example Chapter 4: Applications of ultra-precision CMP in device processes Chapter 5: The future of processing technology Chapter 6: Progress of the semiconductor and silicon industries Chapter 7: Summary

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