Advanced materials for thermal management of electronic packaging

Author(s)

• Tong, Xingcun Colin

Bibliographic Information

Advanced materials for thermal management of electronic packaging

Xingcun Colin Tong

（Advanced microelectronics, 30）

Springer, c2011

• : [pbk]

Note

Includes bibliographical references and index

Details

• NCID: BB11777644
• ISBN:
  • 9781441977588
  • 9781461427926
• LCCN: 2011377399
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: xxi, 616 p.
• Size: 24 cm
• Classification:
  • LCC : TK7870.15
  • DC22 : 621.381
• Subject Headings:
  • LCSH : Electronic apparatus and appliances -- Temperature control
  • LCSH : Electronic packaging -- Materials
• Parent Bibliography ID:
  • BA41247416