Design of adhesive joints under humid conditions

Author(s)

    • da Silva, Lucas F. M.
    • Sato, Chiaki

Bibliographic Information

Design of adhesive joints under humid conditions

Lucas F. M. da Silva, Chiaki Sato, editors

(Advanced structured materials, v. 25)

Springer, c2013

Available at  / 2 libraries

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Note

Includes bibliographical references and index

Description and Table of Contents

Description

This book describes most recent advances and limitations concerning design of adhesive joints under humid conditions and discusses future trends. It presents new approaches to predict the failure load after exposure to load, temperature and humidity over a long period of time. With the rapid increase in numerical computing power there have been attempts to formalize the different environmental contributions in order to provide a procedure to predict assembly durability, based on an initial identification of diffusion coefficients and mechanical parameters for both the adhesive and the interface. A coupled numerical model for the joint of interest is then constructed and this allows local water content to be defined and resulting changes in adhesive and interface properties to be predicted.

Table of Contents

Diffusion of moisture in adhesives.- Diffusion of moisture in interfaces.- Surface treatments for moisture resistance.- Influence of moisture on the adhesive properties.- Influence of water on the interface properties.- Prediction of joint strength under humid conditions: Continuum mechanics approach.- Prediction of joint strength under humid conditions: Fracture mechanics approach.- Prediction of joint strength under humid conditions: Damage mechanics approach.

by "Nielsen BookData"

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Details

  • NCID
    BB1313434X
  • ISBN
    • 9783642376139
  • LCCN
    2013944519
  • Country Code
    gw
  • Title Language Code
    eng
  • Text Language Code
    eng
  • Place of Publication
    Heidelberg
  • Pages/Volumes
    vii, 182 p.
  • Size
    25 cm
  • Classification
  • Parent Bibliography ID
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