Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC

Author(s)

• Li, Er-Ping

Bibliographic Information

Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC

Er-Ping Li

IEEE Press , Wiley, c2012

• : hardback

Note

Includes bibliographical references and index

• NCID: BB13438730
• ISBN:
  • 9780470623466
• LCCN: 2011028946
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Piscataway, N.J.,Hoboken, N.J.
• Pages/Volumes: xiv, 366 p., [8] p. of plates
• Size: 25 cm
• Classification:
  • LCC : TK7874.893
  • DC23 : 621.3815
  • DC20 : 621.3815
• Subject Headings:
  • LCSH : Three-dimensional integrated circuits