Copper electrodeposition for nanofabrication of electronics devices
著者
書誌事項
Copper electrodeposition for nanofabrication of electronics devices
（Nanostructure science and technology / series editor, David J. Lockwood, 171）
Springer, c2014
大学図書館所蔵 全2件
注記
Includes bibliographical references
内容説明・目次
内容説明
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: * ULSI wiring material based upon copper nanowiring * Printed circuit boards * Stacked semiconductors * Through Silicon Via * Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.
目次
Preface (Kazuo Kondo)
PART 1 Copper electrodepositon and additive chemistry
Chapter 1 - Copper electrodeposition (Masayuki Yokoi)
Chapter 2 - Suppression effect and Additive Chemistry (Masayuki Yokoi)
Chapter 3- Acceleration effect (Dale P. Barkey)
Chapter 4- Modeling and Simulation ( Yutaka Kaneko)
PART 2 Copper on chip metallization
Chapter 5- Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects (James R. Rohan)
Chapter 6- Microstructure of Evolution of Copper in Nano-scale Interconnect Features (James Kelly, Christopher Parks, James Demarest, and Christopher Penny)
Chapter 7- Direct Copper Plating (Aleksandar Radisic and Philippe M. Vereecken)
Part 3 - Through Silicon Via and Other Methods
Chapter 8- Through Silicon Via (Kazuo Kondo)
Chapter 9- Build-up Printed Wiring board (Kiyoshi Takagi a and Toshkazu Okubo)
Chapter 10- Copper Foil Smooth on Both Sides for Lithium Ion Battery (Akitoshi Suzuki and Jun Shinozaki)
Chapter 11- Through hole plating (Wei-Ping Dow)
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