Microchip fabrication

書誌事項

Microchip fabrication

Peter Van Zant

McGraw-Hill, c2014

6th ed

タイトル別名

Microchip fabrication : a practical guide to semiconductor processing

大学図書館所蔵 件 / 5

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注記

Includes bibliographical references and index

"IET : the institution of engineering and technology"--cover

内容説明・目次

内容説明

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The most complete, current guide to semiconductor processingFully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors. State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry. COVERAGE INCLUDES: The semiconductor industry Properties of semiconductor materials and chemicals Crystal growth and silicon wafer preparation Wafer fabrication and packaging Contamination control Productivity and process yields Oxidation The ten-step patterning process--surface preparation to exposure; developing to final inspection Next generation lithography Doping Layer deposition Metallization Process and device evaluation The business of wafer fabrication Devices and integrated circuit formation Integrated circuits Packaging

目次

Ch 1. The Semiconductor Industry Ch 2. Properties of Semiconductor Materials and Chemicals Ch 3. Crystal Growth and Silicon Wafer Preparation Ch 4. Overview of Wafer Fabrication Ch 5. Contamination Control Ch 6. Productivity and Process Yields Ch 7. Oxidation Ch 8. The Ten-Step Patterning Process--Surface Preparation to Exposure Ch 9. The Ten-Step Patterning Process--Developing to Final Inspection Ch 10. Advanced Photolithography Processes Ch 11. Doping Ch 12. Layer Deposition Ch 13. Metalization Ch 14. Process and Device Evaluation Ch 15. The Business of Water Fabrication Ch 16. Introduction to Device and Integrated Circuit Formation Ch 17. Introduction to Integrated Circuits Ch 18. Packaging Glossary Index

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