3D IC stacking technology

Author(s)

• Wu, Banqiu
• Kumar, Ajay
• Ramaswami, Sesh

Bibliographic Information

3D IC stacking technology

Banqiu Wu, Ajay Kumar, Sesh Ramaswami

McGraw-Hill, c2011

• : hardback

Other Title

Three D IC stacking technology

Note

Includes bibliographical references and index

"Electrical engineering"--Back cover

Details

• NCID: BB16619469
• ISBN:
  • 9780071741958
• LCCN: 2011016598
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: xviii, 521 p.
• Size: 24 cm
• Classification:
  • LCC : TK7874.893
  • DC23 : 621.3815/3
• Subject Headings:
  • LCSH : Three-dimensional integrated circuits
  • LCSH : Microelectronic packaging